- FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
- HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high density racks.
- REDUCED TOTAL COST OF OWNERSHIP: Get cost savings with high efficiency, high density cooling capacity.
- PEACE OF MIND: Get equipped with redundant pumps, built-in filtration, and unit-to-unit communication capabilities.
- RAPID DEPLOYMENT: Easily and quickly install and deploy this in any data center environment with in-row or perimeter placement.
Product Catalog
Brand: Vertiv
Verticals: High Density Solutions
Vertiv™ CoolChip CDU
The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.
