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Vertiv™ CoolLoop Thermal Wall from 350 to 500 kW

The Vertiv™ CoolLoop Thermal Wall is a turnkey cooling solution delivering 350 to 500 kW, designed to elevate the performance of chilled water air handling units for slab floor installations. Positioned on the gallery side, it supports a wide range of IT loads, from traditional air-cooled systems to advanced hybrid cooling for AI and HPC environments. It helps cloud, hyperscale, and colocation data centers meet key goals such as increasing rack density, reducing operating costs, and accelerating deployment. Additionally, it addresses critical business and technical needs including space optimization, temperature control, operational reliability, enhanced efficiency, and simplified installation.

  • SPEED TO MARKET: eliminates the need for customization with a ready-to-use air handling unit purpose-built for slab floor data centers engineered to maximize the cooling density for unit footprint with all the main components factory installed, thus reducing installation costs on site.
  • COOLING CONTINUITY: enhanced cooling continuity and reliability to extend data center uptime.
  • ENERGY EFFICIENCY: designed to set new efficiency standards combining market-leading technologies and optimizing the aerodynamic impact of all the internal components.
  • HOLISTIC & INTEGRATED CHILLED WATER EXPERIENCE: optimize and control the full thermal chain, from chip cooling to heat recovery, with Vertiv™ free cooling chillers, Vertiv™ iCOM™ smart controls with slab floor-specific algorithms, and Vertiv™ Services for design, commissioning, and ongoing optimization.

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